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Samsung is all set to bring its flagship phones of the year – Samsung Galaxy S9 and Galaxy S9+ at Mobile World Congress to be held on February 27th in Barcelona, Spain while the official sale to be kicked off in March this year.

The upcoming venture of the South Korean tech giant has been a subject of several leaks describing its design features and specifications. The most recent leak provides information about various variants of the Galaxy S9 as well as Galaxy S9+ based on their memory configuration.

According to details, the Galaxy S9 will be packed with 4GB of RAM in two variants based on the internal storage — 64GB and 128GB. While the Galaxy S9+ will come with 6GB of RAM having four storage options — 64GB, 128GB, 256GB and 512GB. However, the 512GB internal storage variant is expected to be available in select regions only that too in limited quantity.

Moreover, renders of both devices surfaced recently on Weibo, revealing that the design of Samsung Galaxy S9 will be very similar to that of Galaxy S8 but the screen-to-body ratio will be higher.

It is also rumoured that Galaxy s9 and Galaxy S9+ will retain the same display sizes as that of their predecessors; that is 5.8-inch and 6.2-inch, respectively. However, the display will be curved, with almost absent bezels on the sides and very narrow bezels on the top and bottom.

As far as other specs are concerned, the earlier reports suggested that both the smartphones will be powered by Qualcomm Snapdragon 845 processor for the US and Chinese market.

However, in other parts of the world, the duo will be powered by the recently announced company’s own Exynos 9810 chipset that comes with improved CPU, GPU performance, artificial intelligence (AI) and deep learning.

Stay tuned to know more about the upcoming flagship devices.